| abstract |
The present invention relates to an IC test apparatus 1, in which at least low temperature thermal stress is applied to the tested IC to conduct the test. The invented apparatus includes the followings: the refrigerating circulating system 210, which is constructed by using configured refrigerant pipeline 216 to at least sequentially connect with compressor 211, refrigerating condenser 212, expanding valve 214 and evaporator 215; and the cold wind supplying system 220, which has blowing fan 223 to supply the tested IC before the test with the gas that is obtained by using the aforementioned evaporating instrument 215 to proceed heat exchange. |