http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-434858-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_88fc7f9eb617072238851d46591a0c76 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48247 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-495 |
| filingDate | 1998-11-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2001-05-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_98f9c0fca6873b5c72a5219dccf4efbe http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_109b37b67896f0c07b38b8d0cac5f490 |
| publicationDate | 2001-05-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-434858-B |
| titleOfInvention | Package and method for dual chips |
| abstract | A package structure and method for dual chips in which the upper and lower surface of the chip socket have a chip each on the lead frame, wherein both chips have a plurality of pads. One of the chips has bumping redistribution structure for redistributing the pad locations on the chip to move to the locations corresponding to the original pad locations. While connecting the pins of the lead frame with the two chips via leads, because the pad location after movement is matched with the pad location on another chip, the leads will not be crossed or wound together during packaging so as to smoothly connect the chip with the pins. |
| priorityDate | 1998-11-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 20.