http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-434652-B

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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3225
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-322
filingDate 1999-10-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2001-05-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ba437c0732e326b04d3e7766ee2c9fef
publicationDate 2001-05-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-434652-B
titleOfInvention Thermal anneal of ideal precipitating wafer to eliminate agglomerated vacancy defects
abstract A process for heat-treating a single crystal silicon wafer to dissolve agglomerated vacancy defects and to influence the precipitation behavior of oxygen in the wafer in a subsequent thermal processing step is disclosed. The wafer has a front surface, a back surface, and a central plane between the front and back surfaces. In the process, the wafer is subjected to a thermal anneal to dissolve agglomerated vacancy defects present in a stratum extending from the front surface toward the center of the wafer. The annealed wafer is then heat-treated to form crystal lattice vacancies, the vacancies being formed in the bulk of the silicon. The heat-treated wafer is cooled from the temperature of said heat treatment at a rate which allows some, but not all, of the crystal lattice vacancies to diffuse to the front surface to produce a wafer having a vacancy concentration profile in which the peak density is at or near the central plane with the concentration generally decreasing in the direction of the front surface of the wafer.
priorityDate 1998-09-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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