| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_57341227c065dbddd1d3cf801bbaa86a |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-2612
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32245
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48247
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-36 |
| filingDate |
1999-10-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2001-03-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b4c868a631fa45dd206880a9ac0f3776
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2838f0457a2f8bcc5eaa33575c970358
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fb1df6eb5baa8b5cea095a0bc68fae6c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dbac5dfa269a0adfccc149119cefd395
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7f5a5c9a985480ec138dc88105cbb3bd |
| publicationDate |
2001-03-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-426926-B |
| titleOfInvention |
Integrated circuit package |
| abstract |
The present invention provides an integrated circuit package, which comprises: a lead frame having a die pad and a plurality of leads, wherein the die pad has a first main surface and a second main surface opposite to the first main surface; a die for connecting to the first main surface of the die pad; and a heat dissipation element including at least one supporting leg, the heat dissipation element having a first face connected to second main surface of the die pad, wherein at least a part of the first face of the heat dissipation element is coated with insulating material or placed with a plurality of separation film, thereby avoiding a short circuit between the heat dissipation element and the plurality of leads. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10063024-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7602050-B2 |
| priorityDate |
1999-10-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |