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filingDate 1999-09-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2001-03-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f108e08230ffc9926790db75dce8b14e
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publicationDate 2001-03-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-425671-B
titleOfInvention Method of manufacturing ferroelectric memory device
abstract A method of manufacturing a ferroelectric memory device which can improve the adhesion between an intermediate insulating layer and a lower electrode and the surface roughness of the lower electrode, is disclosed. According to the present invent, a titanium layer and a first platinum layer are sequentially formed on a semiconductor substrate on which a first intermediate insulating layer is formed. The substrate is then thermal-treated under oxygen atmosphere to transform the titanium layer and the first platinum layer into a titanium oxide layer containing platinum. Next, a second platinum layer for a lower electrode, a ferroelectric thin film and a third platinum layer for an upper electrode are formed on the titanium oxide layer containing platinum, in sequence. The third platinum layer is then etched to form the upper electrode and the ferroelectric thin film, the second platinum layer and the titanium oxide layer containing platinum are etched to form a capacitor.
priorityDate 1998-10-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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