| abstract |
This invention describes a epoxy resin composition for print circuit board, which consists of (a) epoxy resin derived from formation of epoxide groups on the condensation product of phenyl phenol compounds and carboxyl benzyl formaldehyde, (b) condensation product of bisphenol A and formaldehyde, (c) flame-resistant additive, and (d) hardening promoter. The epoxy resin composition for laminate sheet used in print circuit board industry with low hydroscopic rate, excellent heat resistance, electric erosion resistance, thermal coloration resistance and high glass transition temperature. |