http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-415025-B

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_88fc7f9eb617072238851d46591a0c76
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
filingDate 1999-03-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2000-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ce960eddc3bf2968611bdb2c8a10df71
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9dfce7a0650570c72018819595023d6d
publicationDate 2000-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-415025-B
titleOfInvention Manufacture of adhesion layer
abstract A method of forming an adhesion layer and a barrier layer is provided. A titanium layer is formed over a substrate having a via hole or a contact opening by sputtering through a collimator. A titanium nitride layer with nitrogen is formed on the titanium layer by controlling the flow rate of nitrogen and the argon during sputtering. A treatment is performed on the titanium nitride layer having nitrogen and the exposed titanium layer by RF nitrogen plasma such that the titanium nitride layer is strengthened and the exposed titanium layer becomes titanium nitride layer.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102446841-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102446841-B
priorityDate 1999-03-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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