| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7a37d7a7385924dd55e29ac1e96d1492 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12792
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12569
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S205-917
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0355
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24917
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0723
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S428-935
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C2222-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-1291
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12438
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12993
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0307 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-382
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-384
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-605
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C28-345
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D1-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C28-3225 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25F3-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D1-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09 |
| filingDate |
1997-01-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2000-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_04c5f768a89ae2db2c7c2548e193dffb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a25ca6cf5d44a267d4974ee50a01017a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e7a4193afed4b33af6fce46ca6d72afe |
| publicationDate |
2000-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-410533-B |
| titleOfInvention |
Electrolytic copper foil for use in a printed circuit board and process for making the same |
| abstract |
The present invention provides an electrolytic copper foil adequate for superfine pattern applications having an excellent etching characteristic, high-frequency characteristic and excellent insulation reliability at the time of forming wiring patterns. According to the present invention, the surface roughness of the rough surface side before a matte treatment of this electrolytic copper foil is <=1.5 mu m and the surface roughness after the matte treatment on the rough surface is 1.5 to 2.0 mu m. The surface roughness before the matte treatment is adjusted to <=1.5 mu m by polishing the electrolytic copper foil and the rough surface side of the electrolytic copper foil with buff and the surface roughness is adjusted to 1.5 to 2.0 mu m by subjecting the rough surface side to the matte treatment. |
| priorityDate |
1996-01-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |