| abstract |
The object of the present invention is to provide a laminated semiconductor device that can dissipate the heat generated from the semiconductor chips on the module substrate, other semiconductor chips, mother board and heat sink fins; and, when the semiconductor chip is during operation, it can prevent unnecessary temperature rising of semiconductor chip. In order to achieve the purpose, the laminated semiconductor device of the invention comprises a mother board and a laminated module configured on the mother board. The laminated module comprises two or more modules that each module comprises a module board and a semiconductor chip configured on the module board; in which, forming at least one radiator hole or more on each module board and mother board that the radiator holes are made to face the semiconductor chip. |