http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-409366-B

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-822
filingDate 1998-03-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2000-10-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e82e0f899b7aa36241cdfb4a70ac6b82
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_757d2829ca276d600c747d9d334d5980
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publicationDate 2000-10-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-409366-B
titleOfInvention Ferroelectric memory cell and method of making the same
abstract A method of forming a semi-conductor structure forming, on a prepared substrate, a ferroelecuic memory (FEM) gate unit. A gate junction region is formed between the source junction region and the drain junction region for the FEM gate unit on a FEM gate unit device area, which FEM gate unit includes a lower metal layer, a ferroelectric (FE) layer, and an upper metal layer, and which is formed on a conductive channel precursor. The structure of the semiconductor includes a substrate, which may be either bulk silicon or SOI-type silicon, conductive channels of first and second type formed above the substrate, an FEM gate unit formed above a channel region, wherein the FEM gate unit includes a lower metal layer, an FE layer, and an upper metal layer, and wherein a conductive channel of a second type is formed under the FEM gate unit.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111081761-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111081761-B
priorityDate 1997-03-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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