| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_24aca9ded2638ea793d05360dde7a4a0 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0326
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0001 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C07D303-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C07C39-21
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0326
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C07C39-215
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-245
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C07D301-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C07C39-21
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C07D303-23
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C07C39-215
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C07D303-24 |
| filingDate |
1996-04-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2000-10-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0acb4e6ba433f7b67bf1e7f69be9e7da
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ec12b247560b0672bbaa38f0ff61cf8d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4ad0cd7ce5c40fe7554ef392baa27491
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a4d0035f975865f5e463ca85e3e307ac
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1b585ce98e55aa861e65e92f8b858b5d |
| publicationDate |
2000-10-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-408141-B |
| titleOfInvention |
Epoxy resin, resin composition, and resin-encapsulated semiconductor device |
| abstract |
The stilbene epoxy resin having two different aryl groups and the epoxy resin mixture including such stilbene epoxy resin according to the present invention have lower melting points than those of the stilbene epoxy resin having two identical aryl groups and the epoxy resin mixture including such stilbene epoxy resin. Compared with the conventional resins, the resin or resin mixture of the present invention accordingly has improved working and molding properties, thereby shortening the time required for the molding and working process and giving economical advantages and preferable productivity. The epoxy resin or resin mixture according to the present invention is preferably used as adhesive, coating, or insulating material, as electrical or electronic material for laminated sheets or the like, and especially as material for encapsulating electronic parts. |
| priorityDate |
1995-04-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |