| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0f705f295f4ba571f5311e5ef1b57807 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| filingDate |
1999-08-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2000-10-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a6858bb0df3d210a133c6e979464ea65
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e05eb69bfc961438283bfeaa745304fb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7ae4bdb00d5faed162c46f66933d3d1e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8b0ebb71b3c50aa2d6a24efa30fbb344
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_86cb938f170a04378f267ff315502e8a |
| publicationDate |
2000-10-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-407453-B |
| titleOfInvention |
Multiple layer printed circuit board and method for manufacturing the same |
| abstract |
An opening is made in a resin (20) with a laser to form a viahole. A copper foil (22) etched into a thin film (3 mu m) to lower the heat conductivity is used as a conformal mask, thereby making an opening (20a) in the resin (20) by fewer times of irradiation with a pulse laser beam. This prevents formation of any undercut in the resin (20) on which an interlayer resin-insulating layer is to be formed, enabling improvement in the connection reliability of the viahole. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I453420-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7681310-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6766811-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9470715-B2 |
| priorityDate |
1998-09-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |