http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-403793-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c8401bd1a86a10d5508942a53475fc38 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-54 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C14-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-12 |
| filingDate | 1995-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2000-09-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_03ae1ce737c2d3fd5d7e4bde2f0c86b8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_796ff03d097bc8f7fb3fc0e04f8c507c |
| publicationDate | 2000-09-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-403793-B |
| titleOfInvention | A method to deposit metal layer |
| abstract | Polyimide substrates with copper layer are well known for applications in the electronic industry, they are produced by decomposition of metal-organic compound utilizing a glow discharge method, followed by a current free metallization process of the developed metallic film. In case that oxygen was not added during the decomposition of the first metal layer, layers containing carbon will be generated, which have smaller conductivity and smaller catalytic activity. If alkaline metallization solutions were used merely, a most firmly stuck metal layer will be deposit on the surface of the polyimide at the very beginning, but the stickiness of the metal layer to polyimide will reduce considerably after the metal was contact with a watery alkaline solution. If it is processed in an oxygen atmosphere, a palladium layer, which must be reduced later, will be generated. This kind of layers reveals only little or even no stickiness, as they are exposed to chemical or electrochemical processing solutions. Oxygen and carbon lacking layer will be generated by applying combination of oxygen containing compounds and inert gas in the glow discharge process for metal deposition. Nevertheless, the reducing of the stickiness after the metallized substrate was contact with a watery alkaline solution can be avoided by utilizing acid or neutral current free metallization solutions to generate the second metal layer. These methods developed first time the production of a high-density circuit carrier on a non-metallized polyimide foil. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-106413266-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-106413266-A |
| priorityDate | 1995-10-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 70.