http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-402793-B

Outgoing Links

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_88fc7f9eb617072238851d46591a0c76
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-823842
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10B41-49
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10B41-40
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-8238
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-8247
filingDate 1998-12-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2000-08-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6b4b41ecd65bf5235f9ab54085444a8d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e95988f06a38c29904d4855490168775
publicationDate 2000-08-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-402793-B
titleOfInvention Flash memory manufacture method
abstract This invention discloses a manufacture method of the flash memory, which comprises the steps of: dividing a P typed silicon substrate having N well and field oxide into the PMOS, NMOS and flash memory region; forming a first polysilicon layer and a first oxide on the flash memory region; forming a second polysilicon layer, a second oxide and TEOS layer; forming a flash memory unit array with the first photoresist; proceeding an N<+> doping to the source/drain region of the flash memory; after peeling-off the first photoresist, forming a gate structure of the NMOS region with the second photoresist and proceeding N<-> doping to form the LDD in the NMOS region; after peeling-off the second photoresist, forming a first spacer, and proceeding the N<+> heavy doping of the NMOS source/drain region; forming the gate structure of the PMOS region, and peeling off the third photoresist after the LDD step of the PMOS source/drain region; and forming a second spacer oxide, and utilizing the fourth photoresist to form and implant the P<+> source/drain region and to peel off the fourth photoresist.
priorityDate 1998-12-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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