| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_88fc7f9eb617072238851d46591a0c76 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02126
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02274
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31612
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-5096
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-45565
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-4557 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C16-44 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-316
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C16-455
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C16-509 |
| filingDate |
1998-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2000-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_03013b41153eeaf14ddd1a1037505b62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f72446e4e074e9fce97c1d9ab73ebac5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d2e8da5129114cbafddfa485ba733ed1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cd62089d709ebdd87076098b48da5cad
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_248f95787ac432b4da2f44b571d9b664 |
| publicationDate |
2000-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-400548-B |
| titleOfInvention |
The method of improving the uniformity of the thin film's thickness |
| abstract |
This manufacture method is to make use of PECVD system in the thin-film deposition. Before the thin-film deposition, use the plasma to heat the shower head of the PECVD system into the production temperature, coordinate it with the heater block to make the whole system (including the shower head) reaching a stable temperature, then input the process gas through the shower head to form thin film on the chip in order to solve the problem of non-uniformity of the average thickness of the thin film between the chips. If proceed simultaneously the step of warming up the heater block and the plasma heating of the shower head after the PECVD system PM( preventive maintenance) or after cleaning, and in the meanwhile the plasma could also proceed heating toward the heater block, the time of warming up the heater block in the PECVD system (warm-up time) could be reduced. |
| priorityDate |
1998-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |