| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0950e9df7f0e1b73efee1bda859951ad |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-003
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2201-02 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L83-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-295 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-04 |
| filingDate |
1997-11-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2000-07-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_13d6c546cf0a96f0e0ddfc803b3df717
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b5f241b28d9b5370df845f7193581c21
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8e1c4a01f7bdc3c7c34d6b83a076db53
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1ef9b2199e66e4bc2415c714b07f862a |
| publicationDate |
2000-07-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-399248-B |
| titleOfInvention |
Resin composition and semiconductor device employing the same |
| abstract |
A resin composition comprising (a) an epoxy compound, (b) a curing agent comprising a polysiloxane resin having a phenolic hydroxyl group on its side chain, and (c) an inorganic filler. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111234464-A |
| priorityDate |
1996-11-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |