| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d06b49e28e9d72d63125d4e918604fcb |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48247
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45124
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45144
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45147
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01039
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01078
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-45 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49541
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-565
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49558 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-495
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56 |
| filingDate |
1997-11-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2000-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2345f2c6346ed503c4ea90b912358996
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_58f0e11b43bc01d593e992046c0c4339 |
| publicationDate |
2000-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-396565-B |
| titleOfInvention |
Improved leadframe structure and process for packaging integrated circuits |
| abstract |
An improved leadframe structure and an improved IC package and process using such structure are disclosed. The improved leadframe structure eliminates the dambar commonly found on leadframes for use in plastic packages. A polymer structure is formed and employed primarily to act as a barrier to flashing during the epoxy encapsulation process and secondarily to provide support for the leads. The polymer structure remains a permanent part of the IC package following molding. An improved IC packaging process using the improved leadframe design eliminates common debar, dejunk and deflash operations resulting in reduced capital costs and higher yields. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9704785-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I574359-B |
| priorityDate |
1996-11-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |