| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_20c3f69d433d9162ca926126bdac73fd
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5d7576285d411d00c697e07270d2814a |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-66765 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-786
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76888 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-336 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-786
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G02F1-136
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G02F1-1368 |
| filingDate |
1998-01-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2000-04-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e4eefb16a1b5d3cb48d74517466d3d79
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0ba1d2c9fecd08020b614dd0f0a0078d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2d4c877248bb31ced7484d7c31e44c20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b27e03cbe5c77c22d3eac9ea95b318b6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f7b92efc7e793277cd9852d4943c2fc4 |
| publicationDate |
2000-04-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-387095-B |
| titleOfInvention |
Method for forming a contact hole and a multi-layer circuit structure |
| abstract |
A method of forming a contact hole and multi electrode line including (1) depositing a first conductive film on a substrate and patterning the first conductive film to form a first electrode line, (2) depositing an insulating film on the first electrode line and the substrate, (3) forming a contact hole in the insulating film, and (4) depositing a second conductive film on the insulating film and the contact hole, and patterning the second conductive film to form a second electrode line, wherein a surface of the second conductive film is subjected to an oxidizing operation in step (1) so that a contact resistance of the contact hole is reduced. |
| priorityDate |
1997-05-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |