| abstract |
To provide a gold alloy thin wire and a bump formed therefrom with a small neck length stable obtained upon the wire breakage after ball bonding a gold alloy thin wire contains 0.2 to 5000 ppm by weight of Si and the balance of gold and unavoidable impurities. The wire may further contain, other than Si, a total amount of 0.2 to 300 ppm by weight of at least one from the first group of Ca, Be, La, and CE; or a total amount of 1 to 500 ppm by weight of at least one from the second group of Y SC, SR, GA, GE, and In; or a total amount of 2 to 10000 ppm by weight of at least one from the third group of Cu, Pd, Pt, al, and MN. |