| abstract |
An improved solder terminal on a substrate containing at least an electrically conducting member and further having a plurality of electrical contact regions separated by an insulator, the solder terminal comprising: a metallic adhesion layer being etched by a process selective to the electrically conducting member; a CrCu alloy layer covering over and contacting with the adhesion layer; the process selectively etchable over the metallic adhesion layer being further selectively etchable over the CrCu alloy layer; a solder bondable metallic layer covering over and contacting with the CrCu alloy layer; and a solder layer covering over and contacting with the solder bondable layer. |