http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-309643-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_38ed56a4b4e8e2315b2b3308bffedb3f |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-67 |
| filingDate | 1996-10-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 1997-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1a3851283c8e585e1bffa4f1892caf36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5e6cb5ed4b2ef536604c7f9b0c013e37 |
| publicationDate | 1997-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-309643-B |
| titleOfInvention | Method of increasing electrostatic chunking effect by wafer surface processing |
| abstract | A method of improving electrostatic chucking device operating between silicon wafer and susceptor in wafer processing vacuum room comprises of the following steps: (1) supplying one silicon wafer, whose side contacting with susceptor has one insulator on its surface; (2) on the above insulator surface forming one conductive layer; (3) placing the above silicon wafer on susceptor, and the above conductive layer contacts with susceptor. |
| priorityDate | 1996-10-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 40.