http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-307889-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_57341227c065dbddd1d3cf801bbaa86a |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02 |
| filingDate | 1995-03-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 1997-06-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9866504e4aaa66cfb66fc624471f2353 |
| publicationDate | 1997-06-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-307889-B |
| titleOfInvention | Technique of removing anti-reflecting coating of integrated circuit |
| abstract | A technique of removing anti-reflecting coating of integrated circuit comprises of: (1) forming first level metal interconnection pattern, which is constituted by composed layer consisting of Ti, TiN(I), TiW, TiN(II) etc.; (2) forming spin-on-glass(SOG); (3) by plasma etch technology performing etchback to the above SOG, in which the above etchback stops on anti-reflecting coating constituted by TiN(II) on Al metal; (4) by plasma etch technology selectively etching anti-reflecting coating constituted by TiN(II) on the above Al metal. |
| priorityDate | 1995-03-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 27.