http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-307035-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_38ed56a4b4e8e2315b2b3308bffedb3f |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 |
| filingDate | 1996-11-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 1997-06-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ca3571910b9b773bdccd8d3c4f838994 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fac95a9960f30b6c5df53238158d2c5a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_608cae79101cf74d64de399d9ee33816 |
| publicationDate | 1997-06-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-307035-B |
| titleOfInvention | Manufacturing method of metal line |
| abstract | A manufacturing method of metal line comprises of the following steps: (1) supplying one substrate on which there is one formed transistor; (2) forming one metal layer on the transistor; (3) forming one photoresist layer on the metal layer; (4) patterning the photoresist layer; (5) with the photoresist layer as mask, dry etching the metal layer, and in same chamber performing consecutive plasma processing; (6) by plasma containing carbon tetrafluoride and oxygen performing etching post-processing; (7) removing photoresist. |
| priorityDate | 1996-11-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 21.