Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_3a62c92e56568bd104089aac22ca487b |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76838 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-82 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-532 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-495 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-532 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3205 |
filingDate |
1993-05-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
1993-10-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e81857d77e63dcb922a90fe2c8abe5d2 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e752c0a6832de4c5850818fd66097519 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_76b8c14a6b8d79145301e2b18385bf7d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_838fd0ab30a8fdec684dcbbce16425bc |
publicationDate |
1993-10-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
TW-215132-B |
titleOfInvention |
Method and apparatus for the elimination of metal voids and metal lines of a semiconductor device |
abstract |
A method for minimizing metal voids in the metal lines during the manufacture of an semiconductor integrated circuit is described that has significant advantages over previously known methods. The method provides for the use of a nonreactive protective film that is wrapped around the metal lines to prevent the voids. In so doing, the reliability and strength of the electrical connections are significantly improved. |
priorityDate |
1992-09-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |