http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-215132-B

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filingDate 1993-05-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 1993-10-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-215132-B
titleOfInvention Method and apparatus for the elimination of metal voids and metal lines of a semiconductor device
abstract A method for minimizing metal voids in the metal lines during the manufacture of an semiconductor integrated circuit is described that has significant advantages over previously known methods. The method provides for the use of a nonreactive protective film that is wrapped around the metal lines to prevent the voids. In so doing, the reliability and strength of the electrical connections are significantly improved.
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