| abstract |
A positive photosensitive resin composition for a low-temperature process includes an alkali-soluble phenolic resin, a compound having a quinonediazide group, a solvent mixture and at least one additive. The solvent mixture includes a first solvent and a second solvent. The first solvent has a volatilization rate of more than 50 relative to the volatilization rate of n-butyl acetate of 100, and the second solvent has a boiling point ranging between 150°C and 200°C. At least one additive has a molecular weight of 500-5000 and a structural unit as shown in formula (I), wherein Rn 1 is selected from the groups consisting of hydrogen, hydroxyl, C1-C5 alkyl, phenyl, halogen atom, and cyano, Rn 2 is selected from the groups consisting of hydrogen, acid radical, benzene and derivatives thereof, phenols, benzoic acid and derivatives thereof, and aromatic heterocycles, and n is 10~80. It is also provided a method for manufacturing a photoresist film. |