| abstract |
A fluoride-based resin composition, a fluoride-based resin prepreg material and a printed circuit board using the same are provided. The fluoride-based resin substrate includes 100 phr of a fluoride-based resin and 20 to 110 phr of inorganic filler. The fluoride-based resin includes 10 to 80 wt% of polytetrafluoroethylene (PTFE), 10 to 50wt% of fluorinated ethylene propylene (FEP), and 0.1 to 40 wt% of perfluoroalkoxy alkane (PFA). The printed circuit board includes the fluoride-based resin substrate and a wiring layer formed on the fluoride-based resin substrate. |