Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c999fee6428152a996011d506925c2d7 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-025 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-4223 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0353 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-013 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D7-63 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D7-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D7-70 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D5-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D163-00 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 |
filingDate |
2021-02-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5b88ec7fdfbad0e6021c45882fbe661e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_783172beb8a00b39c68177128dca5024 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0bda01b5f2f9c048683a900cb34ede4e |
publicationDate |
2021-12-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
TW-202146574-A |
titleOfInvention |
Resin composition |
abstract |
The subject of the present invention is to provide a resin composition capable of controlling unevenness in lamination of the resin composition; a resin sheet containing the resin composition; a printed wiring board provided with an insulating layer formed using the resin composition, and semiconductor device. The solution of the present invention is a resin composition containing (A) an epoxy resin and (B) an active ester compound having at least one of the groups represented by the following formulae (1) to (3) . In the formula, * represents a bond bond. n represents an integer from 1 to 5. |
priorityDate |
2020-02-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |