| abstract |
An object of the present invention is to provide a curable composition capable of forming a solder resist having both flux resistance and bendability.nThe solution is a hardening composition comprising:n(A) Alkali-soluble resin having at least any one of a bisphenol A structure, a bisphenol F structure, and a urethane structure, (B) a photopolymerization initiator, and (C) having an isocyanurate structure The epoxy resin, and the above-mentioned (C) epoxy resin having an isocyanurate structure has an alkylene chain with 2 or more carbon atoms between the nitrogen atom and the epoxy group in the isocyanurate structure. The structure of the bond. |