abstract |
The invention relates to a resin composition, which can be used for preparing products such as prepreg, resin film, laminated board and printed circuit board. The resin composition of the present invention includes a benzoxazine resin and a maleimide resin having a structure represented by the following formula (1). The product of the resin composition of the present invention has high heat resistance, low dielectric property and high dimensional stability, and can meet the processability requirements of multiple laminations and multiple assemblies in the production process of printed circuit boards. |