| abstract |
An object of the present invention is to provide a polyvalent hydroxy resin and an epoxy resin thereof that can obtain a cured product excellent in heat resistance, low thermal expansion, and moisture resistance, and are useful for lamination, molding, casting, and bonding. The solution of the present invention is a polyvalent hydroxy resin represented by the following general formula (1), Here, A represents a divalent aromatic group; and, n represents a number from 1 to 10. An epoxy resin obtained by reacting the polyvalent hydroxyl resin with epichlorohydrin. |