titleOfInvention |
Adhesive composition, film-like adhesive, adhesive layer, adhesive sheet, copper foil with resin, copper clad laminate, printed circuit board, and multilayer circuit board and manufacturing method thereof |
abstract |
[Technical Problem] Adhesive composition, film-like adhesive, adhesive layer, adhesive sheet, copper foil with resin, copper clad laminate, printed circuit board, and multilayer circuit board and manufacturing methods thereof are provided.n[Technical means] Provide adhesive composition, film-like adhesive, adhesive layer, adhesive sheet, copper foil with resin, copper clad laminate, printed circuit board, and multilayer circuit board and manufacturing method thereof, the adhesive composition The product contains: the reaction product (A) of the monomer group containing acid dianhydride (a1) and diamine (a2), the acid dianhydride (a1) has an aromatic ring structure and/or an alicyclic structure, and the diamine (a2) ) Containing dimer diamine; crosslinking agent (B); and diene polymer (C); as a monomer constituting the diene polymer (C), containing diamine having a 1,2-vinyl structure Vinyl monomers. |