| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_eedd2a00c4d0ba56ecf05fb4b97592dd |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L33-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-004
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-18 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-075
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-028
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L61-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-36 |
| filingDate |
2021-01-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_23a2cf1977d010b878081052e89e05e0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_06e49c4357ba9a177f5e381a5f0d41bf |
| publicationDate |
2021-11-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-202142620-A |
| titleOfInvention |
Curable resin composition, dry film, cured product and electronic parts |
| abstract |
The present invention provides a photosensitive curable resin composition that can form a cured product with excellent resolution and chemical resistance, a dry film having a resin layer obtained from the composition, a cured product or a resin layer of the dry film Hardened objects and electronic parts with the hardened objects.nThe curable resin composition is a curable resin composition containing (A) a carboxyl group-containing resin, (B) a photopolymerization initiator, (C) an epoxy resin, and (D) silicon dioxide. Its characteristics are The aforementioned (D) silica does not contain silica with a particle diameter exceeding 300 nm, and the ratio of the epoxy group of the aforementioned (C) epoxy resin to the carboxyl group of the aforementioned (A) carboxyl-containing resin is 1.9 to 2.9. |
| priorityDate |
2020-03-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |