http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-202136916-A
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8205ec6ee1cd95eb60a03826535bad97 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-12 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-038 |
filingDate | 2020-12-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_64643464c064e73d5eb5c1105c8bb26f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b946eab539dd527dc8c7219008be788c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2a580db05ecb182dae46e81b0f562d39 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0790d013218abfcc044af374604f8282 |
publicationDate | 2021-10-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | TW-202136916-A |
titleOfInvention | Photosensitive insulating film forming composition |
abstract | The present invention provides a negative photosensitive insulating film composition that imparts a hardened body with a low initial dielectric tangent and small changes over time, and a method for manufacturing a substrate with a hardened uneven pattern using the negative photosensitive insulating film composition. And a semiconductor device provided with the cured uneven pattern. A composition for forming a negative photosensitive insulating film, characterized by containing: (A) having the following general formula (1): [In the formula, X 1 is a tetravalent organic group, Y 1 is a divalent organic group, R 1 and R 2 are each independently a hydrogen atom, or the following general formula (2): (In the formula, R 3 , R 4 and R 5 are each independently a hydrogen atom or a monovalent organic group, and m is an integer from 1 to 10. * is the same as the polyamide acid main chain existing in the general formula (1) The carboxylic acid bonding site) represents the group] represents the polyimide precursor of the unit structure; and (B) the following general formula (20): [In the formula, R 23 represents a hydrogen atom or a methyl group, R 24 represents an alkylene group, and R 25 represents an isocyanate group or a blocked isocyanate group] represents an isocyanate compound. |
priorityDate | 2019-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 447.