http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-202136050-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c1755eede76ea7e719a3e0d2843cd793 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68327 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68318 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68386 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-312 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-552 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J133-066 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-78 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-561 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-385 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-568 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-67 |
| filingDate | 2020-11-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_847fd31eddc8515eeee93a2b1d7fe114 |
| publicationDate | 2021-10-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-202136050-A |
| titleOfInvention | Manufacturing method of semiconductor device, and laminated body for semiconductor processing |
| abstract | The object of the present invention is to provide a method for manufacturing a semiconductor device and a laminated body for semiconductor processing that can suppress peeling at the interface between a temporary fixing tape and an adhesive tape for semiconductor processing, and perform a good pickup of a semiconductor package. The manufacturing method of the semiconductor device of the present invention has the following step (3): pick up the semiconductor package with the metal film formed on the back and side surfaces from the adhesive tape for semiconductor processing in the following laminate for semiconductor processing, and the laminate for semiconductor processing The system makes the semiconductor package attached with the adhesive tape for semiconductor processing laminated on the temporary fixing tape in such a way that the side of the adhesive tape for semiconductor processing is in contact, and on the back surface of the semiconductor package attached with the adhesive tape for semiconductor processing And a metal film is formed on the side surface; and in the above step (3), the semiconductor package with the metal film formed on the back surface and the side surface is picked up in a state heated to a temperature T 1 that satisfies the following formula (1). 100＜{Fb(T 1 )/Fa(T 1 )} (1) In formula (1), Fa(t) represents the peeling force of the adhesive tape for semiconductor processing at the temperature t to the copper plate, Fa(T 1 ) represents Fa(t) is the value at temperature t=T 1 , Fb(t) represents the peeling force of the temporary fixing tape at temperature t to the adhesive tape for semiconductor processing, Fb(T 1 ) represents Fb(t) at temperature t=T The value of 1. |
| priorityDate | 2019-11-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 87.