| abstract |
The present invention provides a magnetic paste that can obtain a hardened product with improved scumming resistance and improved adhesion between the magnetic layer and the conductor layer, and the manufacture of circuit substrates, inductor substrates, and circuit substrates obtained by using the magnetic paste method.nThe magnetic paste contains (A) magnetic powder, (B) epoxy resin, (C) reactive diluent and (D) hardener, and (C) component contains trifunctional or more reactive diluent. |