http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-202133976-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c1755eede76ea7e719a3e0d2843cd793 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-0205 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B5-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-34 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-363 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K5-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22 |
| filingDate | 2021-03-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f937c22c1a0acfdff5aa3358af86c770 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_95734e1df4faa2b90d5ca3b1e4109b5c |
| publicationDate | 2021-09-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-202133976-A |
| titleOfInvention | Solder paste, metal coated particles for solder paste, and connection structure |
| abstract | The present invention provides a solder paste which is difficult to wet and spread to unintended areas during connection, and it is easy to maintain the shape of the connection part formed by the solder paste in the connected structure after the connection, and the connection structure after the connection is exposed High connection strength can also be maintained under thermal shock or physical shock.nThe solder paste of the present invention includes a plurality of solder particles and a plurality of metal-coated particles, the metal-coated particles have a specific gravity of 6.0 or less, and the metal-coated particles have a substrate particle and a metal part arranged on the surface of the substrate particle. The metal part includes a metal capable of forming an intermetallic compound with the solder, or a metal capable of fusion bonding with the solder, or a metal capable of diffusing together with the solder. |
| priorityDate | 2020-03-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 314.