| abstract |
A device includes a first die and a second die. The first die includes: a first substrate that contains first electrical circuitry, a first interconnection structure disposed over the first substrate, a first dielectric layer disposed over the first interconnection structure, and a plurality of first bonding pads disposed over the first dielectric layer. The second die includes: a second substrate that contains second electrical circuitry, a second interconnection structure disposed over the second substrate, a second dielectric layer disposed over the second interconnection structure, and a plurality of second bonding pads disposed over the second dielectric layer. The first bonding pads of the first die are bonded to the second bonding pads of the second die. At least one of the first die or the second die includes a metal-insulator-metal (MIM) capacitor. The MIM capacitor includes more than two metal layers that are stacked over one another. |