http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-202130684-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_20d3042eb4ea7c9afd525aa89373349d |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L79-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G8-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L79-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0392 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L61-06 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-039 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-023 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G8-04 |
| filingDate | 2020-12-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_87b99267f268944f21d923986e01fb50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_299e81f5a72b392abdb219280feebbf3 |
| publicationDate | 2021-08-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-202130684-A |
| titleOfInvention | Positive photosensitive resin composition, cured film, and photoresist film |
| abstract | The present invention is a positive photosensitive resin composition, and a cured film and a photoresist film containing the positive photosensitive resin composition, wherein the positive photosensitive resin composition contains: (A) in molar ratio Calculated as (a1): (a2): (a3)=1.0: 0.3～0.8: The range of 0.3～0.8 has a structural unit derived from m-cresol (a1) and a structural unit derived from benzaldehyde (a2) , And the novolak type phenol resin of the structural unit (a3) derived from salicylic aldehyde; (B) from polyimide, polybenzo Azoles, polyimide precursors, polybenzo One or more resins selected from the azole precursor; (C) sensitizer; and (D) solvent. According to the positive photosensitive resin composition of the present invention, it is possible to obtain a cured film and a photoresist film that have high sensitivity and chemical resistance due to low temperature curing. |
| priorityDate | 2019-12-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 139.