| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fcc0b66123940d1b32783569ebfa2d45 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09G1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-00 |
| filingDate |
2020-09-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4c7a27dfeb47ab86a0e868dcc4ee55a7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_59224293f0057bb4dbfd15a239762891
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fdaeb52bc74bb137aaf68816f5474a7b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0e9da099b28f7d445d1f8383c970d137 |
| publicationDate |
2021-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-202128940-A |
| titleOfInvention |
Composition for chemical mechanical polishing and chemical mechanical polishing method |
| abstract |
The present invention provides a chemical mechanical polishing composition and a chemical mechanical polishing method, which can polish a semiconductor substrate containing tungsten, cobalt and other conductive metals at high speed and flatly, and can reduce surface defects after polishing. The chemical mechanical polishing composition of the present invention contains: (A) silica particles containing a functional group represented by the following general formula (1); and (B) a compound containing a hydroxyl group and an ether group. -COO － M + ・・・・・(1) (M + represents a monovalent cation.) |
| priorityDate |
2019-11-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |