| abstract |
The present invention provides a solder paste composition, which comprises: 100 parts by weight of metal powder and 3 to 18 parts by weight of an organic mixture; wherein the organic mixture includes a solvent, a thixotropic agent, and a boiling point less than the melting point of the metal powder The organic acid. The present invention also provides a soldering method, which provides the solder paste composition between a substrate and an object to be soldered to form a composite structure; the composite structure is placed in a cavity through which an acid gas is passed; and The metal powder of the solder paste composition is melted to solder the substrate and the object to be soldered. The solder paste composition of the present invention mainly destroys the metal oxide film on the surface of the metal powder by low-boiling organic acids, avoiding the residual acidic substance from continuously corroding the solder joints, reducing the porosity of the solder joints, and improving the soldering strength of the solder joints. |