| abstract |
Provided is a structure with conductive pattern obtained by a simple producing process and having good interlayer adhesion, and a method for producing the same. A structure with conductive pattern provided in one aspect of the present invention includes a substrate and a conductive layer containing copper arranged on a surface of the substrate, wherein the conductive layer has a porosity rate of 0.01% by volume or more and 50% by volume or less in a first main surface side region ranged from a first main surface to a depth of 100 nm in the thickness direction of the conductive layer, and has a porosity rate of 10% by volume or less in a second main surface side region ranged from a second main surface to a depth of 100 nm in the thickness direction of the conductive layer, if a main surface of the conductive layer on the side facing the substrate is taken as the first main surface and a main surface on the side opposite to the first main surface is taken as the second main surface. |