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filingDate 2020-12-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_30a7638814b9407ffdd50daf03f7c09a
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publicationDate 2021-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-202124972-A
titleOfInvention Probe head for reduced-pitch applications
abstract A probe head for a testing apparatus of electronic devices integrated on a semiconductor wafer of the type comprises: - a first plurality of contact probes (31) having a first transversal diameter; - a second plurality of micro contact probes (36) having a second transversal diameter, smaller than the first transversal diameter of the contact probes (31), said transversal diameter being a maximum extension of a cross section of the contact probes (31) and of the micro contact probes (36), even non-circular in shape; and - a flexible membrane (35) comprising suitable conductive tracks (35C) for electrically connecting a contact probe (31) of the first plurality with a corresponding micro contact probe (36) of the second plurality, the contact probes (31) of the first plurality being arranged between the testing apparatus and the flexible membrane (35) and the micro contact probes (36) of the second plurality being arranged between the flexible membrane (35) and a semiconductor wafer (39), said micro contact probes (36) of the second plurality being configured to abut onto contact pads (37A) of a device under test (37) integrated in the semiconductor wafer (39), each contact probe (31) of the first plurality being in electrical contact with a corresponding micro contact probe (36) of the second plurality through a conductive track (35C) of the flexible membrane (35) and being configured to electrically connect the device under test (37) with the testing apparatus.
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