http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-202124504-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_129e393582e6bdf4029baf2206522f45 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2463-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2363-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-04 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-243 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-249 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-5033 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K7-06 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-01 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-053 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-20 |
| filingDate | 2020-11-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_58a09914e7613ee8ba8954174f75b3c7 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_07f096e77fc07627b1bc99ea1f248312 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9041e81cee86e524bbe8feeec95fa568 |
| publicationDate | 2021-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-202124504-A |
| titleOfInvention | Epoxy resin composition, prepreg and fiber reinforced composite material |
| abstract | The subject of the present invention is to provide an epoxy resin composition having excellent elastic modulus and strength, a prepreg using the epoxy resin composition, and a fiber-reinforced composite material.nThe present invention is an epoxy resin composition that includes the following constituent elements [A] to [C] and satisfies the following conditions (1) to (4).n[A]: Epoxy resinn[B]: Aromatic diaminen[C]: A compound with a boiling point of 130°C or more and a molecular weight m of 50 or more and 250 or less. It has no epoxy group in the molecule and does not substantially have the curing ability of epoxy resin.n(1): At least a part of the component [C] satisfies the Hansen solubility parameter (Hansen solubility parameter), the sum of the polar component and the hydrogen bond component is 10.0 or more.n(2): At least a part of the component [C] satisfies the Hansen solubility parameter distance L of the component [A] to be 20.0 or less.n(3): Ratio C of the molar number E of the epoxy group of the constituent element [A] to the molar number C of the constituent element [C] that satisfies either the aforementioned condition (1) and the aforementioned condition (2) /E is 0.01 or more and 0.20 or less.n(4): The viscosity when kept at 70°C for 2 hours is less than 5.0 times the initial viscosity at 70°C. |
| priorityDate | 2019-11-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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