| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_daadbce47d0b5a698587499f6f1126ec |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-95
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-12 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 |
| filingDate |
2020-06-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f9123b42dae9126be25b801c2fe6efcd
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ca47cda90cea731eed947229a73380f4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7c67119977135f4fc3db6898eb01745b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_396d1fdb94e665b36958a6fca10e1f99 |
| publicationDate |
2021-06-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-202123392-A |
| titleOfInvention |
Electronic part packaging structure, packaging method thereof, LED display panel and LED chip packaging method |
| abstract |
The present invention is an electronic component packaging structure that encapsulates a plurality of LED chips on a wiring substrate. The wiring substrate is provided with a resin-made guide assembly that can guide the LED chips and is elastically deformable, so that it can be accommodated in the packaging area of the plurality of LED chips The LED chip is used to electrically contact the electrode of the LED chip and the bump electrode provided on the wiring substrate. |
| priorityDate |
2019-06-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |