| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4d72711e97d894c55af805c9de2053ab |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B01J2531-824 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1841
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1831
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1637
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1651
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-166
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1844
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1834
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1633
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1689
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-405
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B01J37-16 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-40 |
| filingDate |
2020-10-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a36636322dc988f016e5a8ddf043ea22 |
| publicationDate |
2021-05-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-202118900-A |
| titleOfInvention |
Electroless copper plating and counteracting passivation |
| abstract |
Prior to electroless copper plating on substrates containing copper, an aqueous composition containing select six-membered heterocyclic nitrogen compounds is applied to the substrate. The aqueous composition containing the select six-membered heterocyclic nitrogen compounds counteract passivation of the copper on the substrate to improve the electroless copper plating process. |
| priorityDate |
2019-11-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |