http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-202117940-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c142e57962f1e8e9a64926e72f1fd250 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-44 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-8252 |
| filingDate | 2017-12-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ac2c7bcb68de0d98bcaa2c5dfb41a49d |
| publicationDate | 2021-05-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-202117940-A |
| titleOfInvention | Semiconductor device and method of manufacturing thereof |
| abstract | A method of manufacturing a semiconductor device includes: providing a growth substrate; forming a semiconductor contact structure on the growth substrate; forming a semiconductor stack, having a surface, on the semiconductor contact structure; removing part of the semiconductor stack to expose the semiconductor contact structure; forming a first electrode on the exposed semiconductor contact structure; forming a second electrode on the aforementioned surface of the semiconductor stack; separating the growth substrate; and removing part of the semiconductor contact structure. |
| priorityDate | 2017-12-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 44.