http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-202117849-A

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filingDate 2020-07-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fa62d0fc6bc4a070a57ece5052f6deb6
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publicationDate 2021-05-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-202117849-A
titleOfInvention Method for manufacturing semiconductor structure and capable of controlling thicknesses of oxide layers
abstract A method for manufacturing a semiconductor structure includes forming a first oxide layer on a wafer; forming a silicon nitride layer on the first oxide layer; forming a plurality of trenches; filling an oxide material in the trenches to form a plurality of shallow trench isolation regions; removing the silicon nitride layer without removing the first oxide layer; using a photomask to apply a photoresist for covering a first part of the first oxide layer on a first area and exposing a second part of the first oxide layer on a second area; and removing the second part of the first oxide layer while remaining the first part of the first oxide layer.
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Total number of triples: 24.