| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8e0bf0928b608797b70bbc2b91c7e52e |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-123
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48 |
| filingDate |
2020-09-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a7ad02ea8dd0606d36abf6caeeb2009a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_db3d4b991e9256c1bb3a194beb843686
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_546adabf04a6e6a08326a859d12ddb68
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dc8b6ea3e4c83f4f1ed5da841ba8ce15 |
| publicationDate |
2021-05-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-202117086-A |
| titleOfInvention |
Composition for copper bump electrodeposition comprising a leveling agent |
| abstract |
A composition for copper bump electrodeposition comprising copper ions and at least one additive comprising a polyalkyleneimine backbone comprising N-hydrogen atoms, wherein (a) the polyalkyleneimine backbone has a mass average molecular weight Mw of from 900 g/mol to 100 000 g/mol, (b) the N-hydrogen atoms are each substituted by a C2 to C6 polyoxyalkylene group, and (c) the average number of oxyalkylene units in the polyoxyalkylene group is from more than 10 to less than 30 per N-hydrogen atoms in the polyalkyleneimine. |
| priorityDate |
2019-09-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |