| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_154f5a8a983d88f296117dcc92946ab4 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C01B33-12 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1436
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1454
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K13-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F3-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09G1-02 |
| filingDate |
2020-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_50b1ec6e60723524048b6f90975491ed
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f835a4abf6b44a3ead65113149778153
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7a8bff1c45385053f16390cb234e787a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5b010d45046e0860d47ebbf7043340a2 |
| publicationDate |
2021-05-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-202116969-A |
| titleOfInvention |
Cmp slurry composition for polishing copper films and method of polishing copper films using the same |
| abstract |
A CMP slurry composition for copper films and a method of polishing a copper film using the same are disclosed. The CMP slurry composition includes: at least one solvent selected from among a polar solvent and a non-polar solvent; and polishing particles modified with a silane, wherein the silane is represented by Formula 1. |
| priorityDate |
2019-10-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |