| abstract |
A sealing material for compression molding includes an epoxy resin, a curing agent, and an inorganic filler. In an image obtained by observing, with an ultrasonic flaw detector, a compression molded product obtained by compression molding the sealing material for compression molding on a substrate via silicon chips, an area other than black dots in an area corresponding to the compression molded product on the silicon chips is 86% or more of the total area corresponding to the compression molded product on the silicon chips. |